Design Engineer (Substrate design ) |
| Closing Date 2016-11-25 |
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TalentSource is an Executive Search company providing value-added talent solution to MNC and local clients. We build meaningful and rewarding relationships between top-tier executives and our valued clients, while actively catering to both parties� need for confidentiality, dignity, integrity and professionalism.
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Responsibilities
To prepare & generate substrate design for internal/external customer loading. Work closely with customer from the early conceptual stage of IC package design up till documentation to provide practical and cost effective design solutions.
To prepare & generate substrate design for internal/external customer loading.
Work closely with customer from the early conceptual stage of IC package design up till documentation to provide practical and cost effective design solutions.
Advise customer on design rules related enquiries with design rules and IC packaging knowledge.
Work with R&D engineer and Process engineer to upkeep & update the design rule
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Requirements
Degree in Engineering/Science with more than 3 years of experience in flipchip & array substrate design
Meticulous, independent, analytical and possess good interpersonal skills & communication skills.
Familiar to Cadence APD, SIP.
Fluent in speaking Chinese & English. Have to communicate with customer & factory.
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